| Item | Technical Specification |
| Number of Layers | 2-60 layers |
| Laminate | CEM-3,FR4 (High Tg, Halogen Free),Rogers,Teflon, Arlon, Metal Base (Aluminum, Copper), Mixematerial Kapton, PI, PET for flex. |
| Laminate Brand | KB,Shengyi,Nanya,Isola,Goword,grace,Rogers,Arlon,Taconic,Ventec and customer specify |
| Maximum board size | 610X1 060mm |
| Board thickness | 0.15-4.5mm |
| Minimum line width | 4mils (1oz Cu finished) |
| Minimum Line gap | 4mils(1oz Cu finished) |
| Outer layer copper thickness | 1/3-12OZ |
| Inner layer copper thickness | 1/3-14OZ |
| Min. finished hole size (Mechanical) | 0.20mm |
| Min. finished hole size (laser hole) | 0.075mm |
| Aspect ratio | 10:01 |
| Solder Mask Types and brand | Nanya,Taiyo |
| Solder Mask Color | Gloss & matte green |
| Impedance Control Tolerance | 10% |
| Surface Treatment | HASL lead free,Immersion Gold, Immersion Tin, OSP, ENIG + OSP, Immersion Silver, ENEPIG, Gold Finger |
| V-Cut | V-cut degree | 30+/-5 degree |
| Tol: +/-0.13mm |
| Chamfer | The angle type of the chamfer | 20,30, 45 Degree |
| Plug via hole | Min. size can be plugged | 0.15mm |
| Max. size can be plugged | 0.50mm |
| Largest NPTH hole size | 6.50mm |
| Largest PTH hole size | 6.50mm |
| Min. annular ring can be kept | 6mils |
| Min. distance between the IC pads can keep SM bridge | 8mils |
| Min. SM bridge for green soldermask | 4 mils |
| Min. SM bridge for black soldermask | 5mils |
| Tolerance of outer dimension size | Tol: +/-0.13mm |
| Tolerance of board thickness | T>=1.0mm, Tol: +/-10%
T<1.0mm, Tol:+/-0.1mm |
| Tolerance of finished PTH hole size | Tol: +/-0.075mm |
| Specila Progress | Buried Hole, Blind Hole, Embedded Resistance, Embedded Capacity, Hybrid, Partial hybrid, Partial high density, Back drilling and Resistance contro |
